ACCRETECH (THAILAND) CO., LTD.

AD2000T/S Fully Automatic Dicing Machine: High-Speed, Space-Saving Wafer Dicing Innovation

AD2000T/S is a full-automatic dicing machine compatible with wafers up to 200mm in diameter. Inheriting the design platform of the AD3000T-PLUS, which supports 300mm wafers, and by obliquely arranging opposing dual spindles, it achieves space saving and ease of maintenance. Furthermore, equipped with a 1.8kW high-power spindle, it supports cutting a wide range of materials, from electronic components to power semiconductors.
■ Features
- Space-saving design: Due to the oblique arrangement of the opposing dual spindles, all operations and maintenance can be performed from the front. Even when installing multiple units side-by-side, the side maintenance space is minimized, allowing 5 units of AD2000T to be installed in a space where only 4 units of conventional models could be placed.
- Improved productivity: The dual spindle design and a structure that minimizes X-axis travel reduce cutting time. High-speed operation performance for each axis is as follows: X-axis: max 1,000 mm/sec, Y-axis: max 300 mm/sec, Z-axis: max 80 mm/sec.
- High-power, high-performance spindle: Equipped with a 1.8kW spindle (max rotation speed 60,000 RPM), it supports a wide range of materials from silicon to difficult-to-cut materials. Furthermore, a 2.2kW high-torque spindle is also available as an option.
■ Specifications
- Max. wafer size: 200mm diameter
- Spindle output: 1.8kW
- Max. spindle rotation speed: 60,000 RPM
- X-axis: Cutting range 260mm, Max. speed 1,000 mm/sec
- Y1/Y2-axis: Cutting range 260mm, Max. speed 300 mm/sec
- Power supply voltage: Three-phase AC 200-220V ±10% (Other voltages can be supported with a transformer)
- Max. power consumption: 6.0 kVA
■ Applications
AD2000T/S meets the needs for high-precision, high-speed wafer dicing in the semiconductor and electronic component industries.
- Semiconductor industry: Silicon wafer dicing for processors and memory chips
Power semiconductor wafer dicing for IGBTs, MOSFETs, etc.
- Electronic component industry: Dicing of ceramic substrates for ICs
- Optoelectronics industry: Dicing of LED and laser diode wafers
AD2000T/S is a state-of-the-art wafer dicing machine equipped with a high-power spindle, high-speed axis drive system, and advanced software functions. It supports a wide variety of materials, and further improvements in precision and operational efficiency are possible with optional additions. It will be an optimal choice for semiconductor and electronic component manufacturing.

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AD2000T/S Fully Automatic Dicing Machine: High-Speed, Space-Saving Wafer Dicing Innovation

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