AD2000T/S Fully Automatic Dicing Machine: High-Speed, Space-Saving Wafer Dicing Innovation

The AD2000T/S is a fully automatic dicing machine designed for wafers with a maximum diameter of 200 mm. It inherits its design platform from the AD3000T-PLUS, which supports 300 mm wafers. This model features a diagonally opposite dual-spindle configuration, optimizing space efficiency while improving maintenance accessibility. Additionally, it is equipped with a high-power 1.8 kW spindle, making it suitable for cutting a wide range of materials, from electronic components to power semiconductors.
■ Features
- Space-Saving Design: The diagonally opposite dual-spindle configuration allows all operations and maintenance to be performed from the front. When multiple machines are installed in a row, the side clearance required for maintenance is minimized, enabling five AD2000T machines to fit within the same space that previously accommodated only four older models.
- Enhanced Productivity: The dual-spindle design and minimized X-axis movement help reduce cutting time. The machine supports high-speed operation with:X-axis: Up to 1,000 mm/sec,Y-axis: Up to 300 mm/sec,Z-axis: Up to 80 mm/sec
- High-Power, High-Performance Spindle: Equipped with a 1.8 kW spindle, capable of up to 60,000 RPM, the AD2000T/S supports cutting a wide variety of materials, from silicon to hard-to-cut materials. Additionally, a 2.2 kW high-torque spindle is available as an optional upgrade.
■ Specifications
- Maximum Wafer Size: Diameter 200 mm
- Spindle Power: 1.8 kW
- Maximum Spindle Speed: 60,000 RPM
- X-axis: Cutting range 260 mm, max speed 1,000 mm/sec
- Y1/Y2-axis: Cutting range 260 mm, max speed 300 mm/sec
- Voltage Requirement: Three-phase AC 200-220V ±10% (Supports other voltages with a transformer)
- Maximum Power Consumption: 6.0 kVA
■ Applications
The AD2000T/S is designed to meet the precision and speed demands of the semiconductor and electronics industries, including:
- Semiconductor Industry:Dicing silicon wafers for processors and memory chips
Dicing power semiconductor wafers, such as IGBTs and MOSFETs
- Electronics Industry:Dicing ceramic substrates for integrated circuits (ICs)
- Optoelectronics Industry:Dicing LED wafers and laser diode wafers
The AD2000T/S is a cutting-edge wafer dicing solution, tailored for the semiconductor and electronics industries. It features a high-power spindle, high-speed axis drive system, and advanced software functions to optimize productivity. Supporting a variety of materials, with optional upgrades for greater precision and ease of use, it is the ideal choice for high-efficiency wafer dicing.