Category for specialized cutting equipment that divides semiconductor wafers into individual chips. Includes dicing saws that use diamond blades or lasers to cut silicon wafers with high precision, laser dicing equipment, and plasma dicing equipment. This is a critical process in semiconductor backend operations, enabling precise cutting according to chip size. Features wafer mounting, cutting speed control, and cooling systems for continuous operation in cleanroom environments. Clearly distinguished from other semiconductor manufacturing equipment (etching, exposure, inspection equipment, etc.), this is dedicated equipment for physical cutting and singulation.