This category encompasses specialized equipment and fixtures for securing and holding wafers and chips in semiconductor manufacturing processes. It includes wafer chucks (electrostatic chucks, vacuum chucks), wafer holders, chip bonding fixtures, wafer securing devices for dicing operations, and probe positioning systems for inspection processes. These high-precision devices are designed for cleanroom environments, capable of nanometer-level positioning accuracy and reliable fixturing. This category covers dedicated fixturing systems used in various processes such as etching, deposition, lithography, and inspection, distinguished from general manufacturing jigs and fixtures.