Specialized equipment for sealing and protecting chips and packages with resin or glass materials in semiconductor manufacturing processes. Includes molding equipment, resin sealing machines, vacuum sealing devices, and UV-curing sealing machines used in the final processes of IC, LSI, and power semiconductors. Supports various sealing methods including epoxy resin, silicone resin sealing, glass sealing, and metal sealing to ensure semiconductor device reliability and longevity. Core equipment in semiconductor packaging lines as high-precision manufacturing apparatus integrating temperature control, pressure control, and material supply systems.