Specialized inspection equipment category for quality control and yield improvement in semiconductor manufacturing processes. Handles precision inspection equipment including wafer appearance inspection systems, pattern defect inspection equipment, film thickness measurement devices, CD-SEM (Critical Dimension Scanning Electron Microscope), overlay measurement systems, and particle inspection equipment. Equipment group capable of high-precision measurement functions corresponding to semiconductor device miniaturization and establishing 100% inline inspection systems. Provides inspection solutions specialized for each manufacturing stage from front-end to back-end processes, enabling early defect detection and manufacturing process improvement data collection.