SEIKA SANGYO (THAILAND) CO., LTD.

For IC package baking: Quality preservation with MacDry MB-1001

Enhance the reliability of your IC packages with MacDry MB-1001. Setting new standards in quality preservation with a low-humidity, low-temperature oven.
The MacDry MB-1001 is a low-humidity, low-temperature control oven with a capacity of 1200 liters. It is designed for low-temperature baking of IC packages in accordance with IPC/JEDEC standards. It can bake at a maximum temperature of 50°C and in an environment with a minimum humidity of 1%RH, helping to prevent moisture damage to electronic components, which significantly increases product quality and lifespan.
Features
Low Baking Temperature: Operates at 40°C (maximum 50°C), providing optimal heat treatment for IC packages.
Minimum Humidity Environment: Provides a minimum humidity of 1%RH, suitable for protecting moisture-sensitive components.
Versatile Use: Can be used as a dry cabinet at room temperature when the heater is off.
ESD Protection: Equipped with an ESD protection function in accordance with IEC-61340-5-1 standards to protect IC packages from electrostatic discharge damage.
High-Performance Drying Unit: Dries the interior quickly, supporting efficient baking processes.
Large Digital Humidity Meter: Allows precise monitoring of internal humidity, enhancing quality control accuracy.
Load Capacity: Each shelf can support up to 100 kg, suitable for storing heavy items.
Applications
The MB-1001 provides an optimal environment for storing and processing IC packages, semiconductor devices, and other moisture-sensitive electronic components. Baking in a low-humidity, low-temperature environment helps prevent component degradation, thereby increasing product reliability.
The MacDry MB-1001 is a highly effective tool for electronic device manufacturers to maintain the quality of IC packages. With its low-humidity, low-temperature oven, the MacDry MB-1001 significantly helps preserve quality and extend product lifespan.
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