Thermal analysis equipment that measures dynamic viscoelastic properties by applying periodic mechanical stress to materials while varying temperature. Evaluates storage modulus, loss modulus, and loss tangent (tanδ) of plastics, rubber, composite materials, and adhesives as functions of temperature and frequency. Enables precise measurement of glass transition temperature, material heat resistance evaluation, curing reaction tracking, and creep property analysis. Essential for quality control and new material development in automotive parts, electronic materials, and construction materials. Unlike static measurement TMA, this equipment group specializes in viscoelastic analysis under dynamic loading.