Specialized test equipment for evaluating durability and reliability of electronic components, automotive parts, resin molded products and other materials by applying thermal stress through rapid temperature changes. Conducts thermal cycle testing in temperature range from -70°C to +200°C by moving samples between high and low temperature chambers. Used for evaluating thermal fatigue characteristics and joint reliability of semiconductor devices, electronic boards, and metal parts, capable of testing in compliance with IEC, JIS, and MIL standards. Unlike constant temperature and humidity chambers, this equipment specializes in temperature change rate and temperature differential, also called thermal shock test chamber or temperature cycle test chamber. Essential equipment for product qualification testing in quality assurance departments and material evaluation in research and development.