This category encompasses specialized equipment dedicated to electronic component manufacturing. It includes manufacturing equipment for producing electronic components such as semiconductor chips, resistors, capacitors, ICs, and substrates. The scope covers precision manufacturing equipment including die bonding equipment, wire bonding equipment, encapsulation equipment, inspection equipment, and mounting equipment. Unlike general machining or assembly equipment, this category focuses on equipment specialized for micro-processing and high-precision mounting in cleanroom environments. It is distinguished from final assembly equipment for electronic devices or substrate manufacturing equipment, being limited to equipment used in the manufacturing processes of electronic components themselves.