Epoxy Remover E-Solve 21HE / Eco-Friendly PCB Cleaning / Low Toxicity Hardened Resin Stripping Agent

KANEKO CHEMICAL (THAILAND) CO., LTD. provides e Solve 21HE in Thailand. Available in 1 kg packaging, this product is specifically engineered for dissolving epoxy resin and supporting circuit board repair processes.

Table of Contents

• Features of e Solve 21HE

• Technical Specifications

• Usage Guidelines and Precautions

• Industrial Applications

• Frequently Asked Questions (FAQ)

Features of e Solve 21HE

e Solve 21HE is a high-performance dissolving agent developed as a safe substitute for Dichloromethane. It focuses on operator safety and technical efficiency:

• High Dissolving Power: Effectively causes cured epoxy resin to soften and swell, allowing it to be stripped from surfaces quickly.

• Enhanced Safety: Formulated with low-toxicity compounds to reduce health risks compared to traditional stripping agents. It is also exempt from several hazardous substance regulations.

• Reduced Processing Time: Simplifies the resin removal process by replacing mechanical methods, significantly improving operational throughput.

• Fire Safety: The product has no flash point, ensuring easy management and storage within factory environments.

Technical Specifications

Usage Guidelines and Precautions

To ensure maximum efficiency during the resin stripping process, please follow these steps:

1. Preparation: Use a chemical-resistant container suitable for the solvent.

2. Soaking: Fully immerse the component or circuit board in e Solve 21HE. Immersion is essential for the chemical reaction to occur.

3. Duration: Allow the component to soak until the resin softens or swells enough to detach. Heating the solution can be applied to accelerate the dissolution rate.

4. Rinsing: Once the resin is removed, rinse the workpiece thoroughly with alcohol or the specialized "e Clean 21RSN" to ensure a clean surface.

※ For more details, please download the attached PDF or contact us via the form below.

Industrial Applications

e Solve 21HE is suitable for various technical operations:

• Electronics Rework and Repair: Stripping protective coatings from circuit boards to replace components.

• Quality Control: Decapsulation of sealed devices to inspect internal failures or bond wires.

• General Maintenance: Removing resin buildup from mixing pots, jigs, and molds.

Frequently Asked Questions (FAQ)

Q: What types of epoxy materials can e Solve 21HE handle?
A: It is technically designed to dissolve and strip cured epoxy resins, potting materials, and industrial adhesives that are typically resistant to standard solvents.

Q: Is heating mandatory for the process to work?
A: No, the agent is effective at room temperature via immersion. However, applying controlled heat can significantly increase the dissolving speed and overall process efficiency.

Q: How does this product improve workplace safety compared to old solvents?
A: Unlike traditional dichloromethane-based strippers, e Solve 21HE has lower toxicity and no flash point. This reduces the administrative burden regarding hazardous material handling and improves the environment for operators.

Q: Is it safe for all electronic components?
A: While it is designed for resin removal, we recommend performing a material compatibility test on non-epoxy parts of the assembly, as the swelling action might affect certain sensitive plastics or coatings.

※ For more details, please download the attached PDF or contact us via the form below.