Athlete FA: Design, Manufacturing, and Sales of Automation Equipment
Micro Ball MounterThe demands of the times have evolved surface mounting into various forms. Among these, BGA (Ball Grid Array) and CSP (Chip Scale Package) have become the most widely used types, applied in a wide range of products from smartphones and tablets to wearable devices and automotive components. Athlete FA has consistently adopted cutting-edge technology since the advent of BGA, boasting an impressive track record, especially in the installation of small-diameter balls for CSP.
Flip Chip Bonder
The ultimate form of mounting... flip chip technology. In 1991, Athlete FA was the first in the industry to externally sell flip chip bonders. Since then, the company has remained a top leader in flip chip mounting.
Custom Equipment
Athlete FA combines various elemental technologies to create FA (Factory Automation) equipment tailored to meet customer needs.
TAB (Tape Automated Bonding)
Athlete FA's TAB technology, cultivated over many years in precision equipment assembly, blossomed significantly with the rapid growth of LCD drivers and the advent of COF (Chip on Film).
LCD Systems
LCD (Liquid Crystal Display), which has made great strides as a replacement for CRT (Cathode Ray Tube) displays, continues to demand larger sizes, higher resolution, and lower prices. Athlete FA responds flexibly to high-level customer requirements.
自動車電装品 / 通信機器 / 半導体
