Industrial Resin Remover eSolve 21 Series / Fast-Acting Resin Peeling Fluid / Eco-Safe & Low Toxicity

KANEKO CHEMICAL (THAILAND) CO., LTD. provides the eSolve 21 Series in Thailand. This product range supports resin peeling and parts maintenance for high-standard industrial manufacturing.

Table of Contents

• Features of eSolve 21 Series

• Supported Materials and Resins

• Technical and Safety Specifications

• Industrial Application Examples

• Application Method

• Frequently Asked Questions (FAQ)

Features of eSolve 21 Series

The eSolve 21 Series is a specialized resin dissolving agent developed as a safe alternative to Dichloromethane. It effectively facilitates the swelling and dissolution of cured resins from various substrates.

• Reduced Toxicity: Engineered to mitigate health and environmental risks compared to traditional chlorinated solvents.

• Enhanced Reuse Rate: Enables the removal of resins from electronic components or precision jigs, allowing for the recovery and reuse of high-value parts.

• Product Versatility: Available in multiple grades specifically formulated for different resin types and surface materials.

Supported Materials and Resins

The eSolve 21 Series is technically capable of processing a wide variety of polymer materials:

• Epoxy

• Polyurethane

• Silicone

• Acrylic

• Polyester

• ABS

• Polycarbonate

Technical and Safety Specifications

The dissolving agents from KANEKO CHEMICAL (THAILAND) CO., LTD. are designed with a focus on environmental compliance and operator safety.

• Hazardous Substance Replacement: Developed to replace Dichloromethane, which is strictly regulated in many industries.

• Environmental Profile: Features a low Ozone Depletion Potential of 0.013 and an extremely low Global Warming Potential of 0.0001.

• Metal Surface Precautions: Certain grades, such as eSolve 21RS, 21RZ, and 21KZE, may react strongly with specific metals like Aluminum, Magnesium, and Zinc. It is mandatory for users to perform a small-scale compatibility test before full application.

For more details, please download the attached PDF or contact us via the form below.

Industrial Application Examples

• Electronics Production Lines: Used for stripping resins or resist inks in cases of production defects.

• Jig and Mold Maintenance: Removal of resin buildup on fixtures and dissolution of gas or rubber residues on molds.

• Failure Analysis: Used to strip potting resins to expose internal contacts or circuits for inspection.

Application Method

The application process for the eSolve 21 Series focuses on simplicity to minimize the need for complex equipment:

1. Immersion: Place the component in a container filled with the agent. (Manual wiping with a soaked cloth may be applicable in specific cases).

2. Duration: Allow the component to soak until the resin swells or dissolves. Timeframes depend on the resin type and thickness.

3. Cleaning: Once the resin is removed, thoroughly clean the part to remove residual agent. For acidic grades (e.g., RS model) or highly alkaline grades (e.g., KZE model), rinsing with Alcohol, DI Water, or the specialized "eClean 21RSN" is required.

Frequently Asked Questions (FAQ)

Q: Can this agent be used on all types of plastics?
A: Due to its high dissolving power, certain plastics such as ABS or Polycarbonate may be affected. It is essential to select the appropriate grade based on your specific substrate.

Q: Is heating required during the process?
A: The eSolve 21 Series typically performs effectively at ambient temperatures. However, applying controlled heat can increase the dissolving speed and chemical efficiency depending on the application requirements.

Q: Can the used agent be recycled?
A: Yes, the agent can be recovered and recycled for reuse, which significantly reduces long-term maintenance and operational costs.

For more details, please download the attached PDF or contact us via the form below.